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ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20
ERSA HOTFLOW 2/20

ERSA HOTFLOW 2/20 reflow oven

19.820€ Netto

Tomasz Konieczko

Tomasz Konieczko

+48 889 742 382

tomasz.konieczko@maszyneria.pl

Sławomir Konieczko

Sławomir Konieczko

+48 603 510 566

info@maszyneria.pl

Category: Furnaces
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  • Description

ERSA HOTFLOW 2/20 reflow oven was built in 2007 in Germany by ERSA GmbH. It is a specialist machine dedicated to reflow soldering, one of the basic soldering techniques in high-volume production of electronic components. Electronic components are joined to the printed circuit board PCB by means of solder paste, which is melted at a controlled temperature. This results in extremely durable and precise connections, which is crucial in the production of modern electronic devices.

ERSA HOTFLOW 2/20 sets the highest standards in lead free reflow soldering. It allows the soldering of all, even the most thermally sensitive components on printed circuit boards PCB with a maximum width of 510 mm. The workspace consists of 20 separately controlled heating zones and 3 cooling zones with precise temperature control, which provide maximum flexibility in terms of soldering profile configuration. The HOTFLOW 2/20 reflow soldering machine also features, among others, a conveyor, an extraction system and a control system with ERSAsoft software. The total weight of the machine is approximately 2700 kg.

Technical specifications of the ERSA HOTFLOW 2/20 reflow soldering system

General data

  • PCB printed circuit board width: 50-510 mm
  • PCB printed circuit board minimum length: 100 mm
  • PCB printed circuit board clearance: +35/-25 mm
  • work space dimensions (L x W): 4840 x 700 mm
  • length of infeed zone: 700 mm
  • length of outfeed zone: 700 mm
  • conveyor speed: 20-200 cm/min
  • distance from floor to conveyor surface: 820-850 mm
  • gas flow (nitrogen): 0-30 m3/h
  • gas injection (nitrogen): in the soldering zone
  • extraction system capacity: 2x 400 m3/h
  • compressed air connection: 6-8 bar
  • nitrogen connection: 6-10 bar
  • maximum ambient temperature: 30°C
  • noise level: <64 dB(A)
  • power: 80.5 kW
  • power supply: 3x 400 V; 50/60 Hz
  • dimensions (L x W x H): 6240 x 1500 x 1370 mm
  • weight of the ERSA HOTFLOW 2/20 machine: approx. 2700 kg

Heating zones

  • number of heating zones: 10x top/bottom, of which:
  • – preheating zones: 7x top/ 7x bottom
    – soldering zones: 3x top/ 3x bottom

  • total length of heating zone: 3620 mm
  • gas flow per zone: adjustable, up to 500 m3/h

Cooling zones

  • number of cooling zones: 3x top/bottom
  • total length of cooling zone: 1200 mm
  • coolant: water/air

Equipment of the ERSA reflow oven

  • control system with ERSAsoft software
  • process atmosphere monitoring per zone (1 pc.)
  • process atmosphere cleaning in cooling zone
  • adjustment of fan speed in heating and cooling zones
  • conveyor
  • push-button for adjusting the conveyor width
  • automatic lubrication of conveyor and central support
  • main switch (1 pc.)
  • emergency stop button (4 pcs.)
  • lamp indicating machine status
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